The rapid evolution of technology necessitates innovative solutions for electronic systems. The 8-layer soft and hard composite HDI boards from Mingzhenghong Electronics Co., Ltd. stand out as a prime example of such innovation. By marrying the rigidity of FR-4 with the flexibility of PI (Polyimide), these boards address the complex needs of modern electronics.
These boards feature advanced high-density interconnect (HDI) technology, accommodating a miniature hole size of just 0.125mm and notable line widths of 4mil in rigid areas and 3mil in flexible regions. The surface treatment with ENIG and a gold plating of 3 micrometers maximizes conductivity and corrosion resistance, ensuring long-lasting performance.
The 8-layer soft and hard composite HDI board is engineered for a variety of applications:
Mingzhenghong guarantees that the FR-4 and PI materials used in our HDI boards comply with environmental standards, addressing the market's shift towards sustainable development.
Not only are these boards functional, but their aesthetic design—with green solder mask and yellow cover layer—enhances both user experience and durability, making them an excellent choice for manufacturers aiming for premium quality.
In conclusion, the 8-layer soft and hard composite HDI boards showcase exceptional performance, durability, and versatility, making them indispensable in today's high-tech landscape. Embrace the future of electronics with Mingzhenghong's innovative solutions.
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Flexible PCB
Polyimide Circuit Board
FPC
Custom PCB Manufacturing
High Precision Circuit
