Overview of the 8 Layer Soft and Hard Composite HDI Board

The 8-layer high-density interconnect (HDI) soft and hard composite board is an innovative electronic circuit solution expertly crafted by Mingzhenghong Electronics. This product utilizes a combination of FR-4 (ITEQ) and PI (polyimide) as substrates, delivering both rigidity and flexibility. Measuring 143.2 X 156.43 mm, with a thickness of 2.0 mm for the rigid portion and 0.15 mm for the flexible section, it features a copper thickness of 35 microns on both inner and outer layers.

With a minimum hole size of 0.125 mm, the rigid area features a minimum line width of 4 mil, while the flexible area has a line width of 3 mil. Line spacing is maintained at high precision with 3 mil in the rigid region and 2 mil in the flexible area. The surface undergoes ENIG (Electroless Nickel Immersion Gold) treatment, plated with a 3-micron thick layer of gold to enhance both conductivity and corrosion resistance.

Key Features and Benefits

• Innovative Combination: Merges the stability of rigid PCBs with the flexibility of FPCs, catering to the compact and complex layout requirements of advanced electronic devices.
• High-Density Interconnection: HDI technology enables smaller hole sizes (0.125mm) along with high precision line widths and spacings, suitable for intricate electronic systems.
• Exceptional Durability: The ENIG process ensures a 3-micron gold layer, enhancing conductivity and corrosion resistance for long-term reliability.
• Eco-Friendly Materials: The FR-4 and PI substrates meet environmental standards, aligning with sustainable market trends.
• Aesthetic Design: The green solder mask on the rigid area and the yellow cover layer on the flexible area not only enhance the visual appeal but also improve the product's usability and durability.

Applications

• Mobile Communications: Provides complex and reliable circuit solutions for smartphones, wearables, and other mobile devices.
• Precision Medical Devices: Meets the high precision and stability demands of medical equipment like portable monitoring devices and imaging systems.
• Industrial Automation: Suitable for automation control systems requiring redundancy and efficient machine operation.
• High-End Camera Modules: Supports high-definition capture in camera modules, enhancing the performance and stability of imaging systems.
• Lighting Systems: Ideal for smart lighting control systems, especially those requiring flexible installations in compact spaces.

The 8 Layer Soft and Hard Composite HDI Board exemplifies the integration of advanced technology and practical application, ensuring quality and reliability for its users.