Product Overview

Introducing the 8-layer high-density interconnect (HDI) soft and hard composite board from Mingzhenghong Electronics Co., Ltd. This innovative circuit solution expertly blends the rigidity of traditional PCBs with the flexibility of flexible circuit boards (FPCs), allowing for a highly versatile and compact design suitable for today's advanced electronic applications.

Key Features

• 🌟 Innovative Combination: Merges the stability of rigid PCBs with the flexibility of FPCs, addressing the needs for compact and complex layouts.
• 🔗 High-Density Interconnect: Features ultra-small vias (0.125mm) and precise line widths (rigid area 4/3mil, flexible area 3/2mil), ideal for dense electronic systems.
• ⚡ Durability: ENIG processing adds a 3-micron gold layer, enhancing conductivity and corrosion resistance for long-term reliability.
• 🌱 Eco-Friendly Materials: Composed of FR-4 and PI substrates that comply with environmental standards, aligning with sustainable market trends.
• 🎨 Aesthetic Appeal: Green solder mask and yellow cover layer not only enhance the product's appearance but also its durability.

Applications

Our 8-layer board is perfect for:

• 📱 Mobile Communications: Providing reliable and complex circuitry for smartphones and wearables.
• 🏥 Precision Medical Devices: Ensuring high precision and stability in portable medical equipment and imaging devices.
• 🏭 Industrial Automation: Suitable for automated control systems requiring redundancy and efficient operation.
• 📷 High-End Camera Modules: Enhancing image systems with superior performance and stability.
• 💡 Smart Lighting Systems: Ideal for smart lighting applications, particularly where curvature or compact design is essential.

Explore how our 8-layer soft and hard composite HDI board can elevate your product's performance while meeting the demands of modern technology. Let's connect and redefine your electronic solutions today!