Unleashing the Power of High-Frequency PCB Solutions

In the fast-paced world of telecommunications, robust and reliable circuit boards are integral to facilitating high-speed and efficient data transmission. Mingzhenghong Electronics proudly presents our advanced 24-layer high-frequency PCB circuit boards, meticulously engineered to meet the stringent demands of the telecom industry.

Our 24-layer PCBs are designed with state-of-the-art Isola 370HR material, ensuring exceptional electrical performance for high-frequency applications. The use of ENIG surface treatment guarantees excellent solderability and long-term oxidation resistance, vital for sustaining performance over time.

Key Features Include:

• Robust impedance control supporting both 50-ohm single-ended and 100-ohm differential pair configurations for optimal signal integrity.
• Precision in thickness control (1.6mm±0.16mm) and copper thickness (1 oz outer layer/0.5 oz inner layer) tailored to meet intricate electrical requirements.
• Ultra-fine drilling capabilities (minimum 0.2mm) combined with high-precision line width/spacing (0.075mm/0.075mm), catering to complex PCB designs.
• Automated Optical Inspection (AOI) to ensure every board meets rigorous quality standards, free from defects.

Applications that Benefit

Our PCBs find utility across various sectors, including:

• Telecommunication systems—like base stations, routers, and switches.
• Networking devices requiring high signal stability and compact circuit layouts.
• Enterprise-level servers and storage systems demanding high signal integrity.
• Complex electronic devices in high-end medical, military, and aerospace applications.
• Emerging 5G technologies and supporting equipment, vital for the high-frequency signal processing.

With strict adherence to international standards such as IPC, RoHS, and REACH, our products ensure quality that meets global market requirements. Choose Mingzhenghong Electronics for your high-frequency PCB needs and experience the difference in reliability, performance, and innovation.