Introduction

The 8-layer high-density interconnection (HDI) soft and hard composite board represents an innovative circuit solution crafted by Mingzhenghong Electronics Co., Ltd. Combining both rigid and flexible characteristics, this product caters to the intricate needs of advanced electronic devices.

Key Features

This HDI board utilizes a composite of FR-4 and Polyimide (PI) substrates, measuring 143.2 x 156.43 mm, with a thickness of 2.0 mm for the rigid part and 0.15 mm for the flexible part. It achieves a minimum hole diameter of 0.125 mm and maintains superior line width specification of 4mil for the rigid area and 3mil for the flexible area.

Engineered with ENIG surface treatment and a gold layer thickness of 3 microns, it enhances conductivity and corrosion resistance, ensuring long-term reliability. Additionally, the green solder mask and yellow cover layer create an aesthetically pleasing product that stands out in sophistication.

Applications

Our 8-layer HDI board is perfect for mobile communications, precision medical devices, industrial automation, high-end camera modules, and lighting systems. It meets the advanced demands of compact and complex system layouts, becoming an indispensable part of modern technology.

Conclusion

In conclusion, the 8-layer soft and hard composite HDI board is not just a product; it is a testament to Mingzhenghong Electronics' commitment to innovation and quality. Its high-density interconnection capabilities redefine reliability and efficiency in electronic designs, setting a benchmark in the industry.