Introduction

The 8-layer high-density interconnect (HDI) soft and hard composite board represents a groundbreaking achievement in electronic circuit solutions. Manufactured by Mingzhenghong Electronics Co., Ltd., this product expertly merges the rigidity of traditional PCB with the flexibility of FPCB, creating a versatile circuit platform tailored for high-end electronic applications.

Technical Specifications

With a size of 143.2 X 156.43 mm and varying thicknesses of 2.0 mm for the rigid section and 0.15 mm for the flexible part, the board utilizes high-quality FR-4 (ITEQ) and PI (polyimide) substrates. Its advanced manufacturing process results in minimum hole diameters of 0.125 mm, and precise line widths of 4 mils for the rigid area and 3 mils for the flexible area.

In addition, the surface is treated with an ENIG process, ensuring enhanced conductivity and corrosion resistance thanks to a 3-micron gold plating. This makes the board exceptionally reliable for various demanding applications.

Key Benefits

This innovative board offers remarkable advantages:

• Innovative Combination: Integrates the stability of rigid PCBs with the flexibility of FPCs, fulfilling the compact and complex layout demands of advanced electronic devices.
• High-Density Interconnection: Utilizes HDI technology to achieve smaller apertures (0.125mm) and high precision line width/spacing, suitable for intricate electronic systems.
• Superior Durability: The ENIG process endows the gold layer with enhanced conductivity and corrosion resistance, ensuring long-term reliability.
• Eco-Friendly Materials: Compliant with sustainability trends, the FR-4 and PI substrates fulfill environmental requirements.
• Aesthetic Design: The combination of green solder mask and yellow cover layer not only enhances functional capability but also contributes to a superior user experience.

Applications

This product is particularly suited for:

• Mobile Communications: Providing complex and reliable circuit solutions for smartphones and wearable devices.
• Precision Medical Devices: Meeting the high precision and stability standards required by portable medical monitoring equipment and imaging devices.
• Industrial Automation: Perfectly applicable for automation control systems needing redundancy designs and high operational efficiency.
• High-End Camera Modules: Supporting camera modules for enhanced image acquisition, improving the performance and stability of imaging systems.
• Lighting Systems: Suitable for intelligent lighting control systems, particularly beneficial in compact design and curved installations.

In conclusion, the 8-layer soft and hard composite HDI board stands out as a top-tier solution for various high-tech applications, making it an essential component in today’s advanced electronic landscape.